公司名称：昆山佰易仪器设备有限公司
Company name : KunShan BaiYi Instrument Equipment Co.,Ltd
公司地址：江苏省昆山市牧野路99号3号房
Add:3# Building No.99,Muye Road ,Yushan Town ,Kunshan City ,Jiangsu,China
联系电话Tel：0512-57991570
电子信箱Email：sales@ksbuye.com
pm@ksbuye.com
联 系 人 Contacts：高先生
手机号码 Cell phone：18606297225
桌上型视觉伺服点胶机 Desktop CCD Servo Glue Dispensing Robot
技术参数：Specification
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型号(Model) |
BY-4500EDS |
BY-5500EDS |
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工作范围（Work Area） |
400(X)╳400(Y)╳100(Z)mm |
500(X)╳500(Y)╳100(Z)mm |
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外观尺寸(Size) |
590(L)*740(W)*681(H)mm |
690(L)*840(W)*681(H)mm |
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最大负载Y/Z(Max load) |
20kg/10kg |
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最大空移速度(Travel speed) |
400mm/sec(XY)/200mm/sec(Z) |
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轴传动方式(Drive mode) |
伺服马达/滚珠丝杆+精密直线导轨(Servo motor/ball screw+linear guide rail) |
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XYZ定位精度(Repeatability ) |
±0.02mm |
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程序储存容量(Program capacity) |
999个参数文件(每个文件65535点)(999 parameter files(65535 points per file)) |
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操作系统(Operation system ) |
液晶面板/手持式编程器(LCD panel /Teach pendant) |
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运动模式(Movement pattern) |
3轴点到点、连续直线、圆孤(3 axis point to point,continuous line, arc) |
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扩展IO(I/O signal ports) |
4输入/4输出(4 inputs/4 outputs) |
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输入电源(Power supply) |
AC220V 50/60HZ 0.7KW |
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工作环境(Work condition) |
温度0-40℃ 相对温度20-90%(Temperature 0-40℃;humidity 20-90%) |
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重量(Weight) |
约45KG(About45KG) |
约55KG(About55KG) |
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应用：Application
1.适用流体点胶，例如： UV胶、AB胶、EPOXY(黑胶)、白胶、EMI导电胶、SILICON、环氧树脂、瞬间胶、
银胶、红胶、锡膏、散热膏、防焊膏、透明漆、螺丝固定剂等；
It is applied to fluid dispensing, such as, UV glue, AB glue,COB(black glue), white glue, EMI conductive
glue, silicon, epoxy resin, instant glue, silver glue, red glue, paste, thermal grease, welding control paste,
transparent paint, screw fixative and so on.
2. 应用于PCB电子配件固定及保护，手机、笔记本外壳粘接，LCD玻璃，LED点胶，双摄像头点胶与封装，指纹模组点胶，汽车配件涂覆，芯片绑定，电池封装，喇叭点胶，SMT底部填充、元件封装、点锡膏、点红胶、点黑胶、半导体封装、晶元固定等
Applied to PCB electronic accessories fixed and protection, and mobile phone, notebook shell adhesive, LCD glass, LED point glue, dual cameras dispensing with encapsulation, fingerprint module point glue, auto parts coated, chip binding, battery encapsulation, horn point glue, SMT at the bottom of the filling, packaging, dispensing, points the red plastic, vinyl, semiconductor packaging, wafer fixed and etc .
