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公司名称:昆山佰易仪器设备有限公司

Company name : KunShan BaiYi Instrument Equipment Co.,Ltd

公司地址:江苏省昆山市牧野路99号3号房

Add:3# Building No.99,Muye Road ,Yushan Town ,Kunshan City ,Jiangsu,China

联系电话Tel:0512-57991570

电子信箱Email:sales@ksbuye.com
pm@ksbuye.com

联 系 人 Contacts:高先生

手机号码 Cell phone:18606297225 

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  • 自动贴标机 Automatic Labelling Machine


    技术参数 Specification

    适用标签长度 Applicable label length (mm) 6mm~250mm
    适用产品尺寸(长×宽×高/厚)
    Applicable product size
    (length x width x height/thickness)
    length: 40mm ~ 280mm
    width: 40mm ~ 200mm
    height: 0.2mm ~ 20mm
    适用标卷外径(mm):
    Applicable standard volume outer diameter
    φ 280mm
    适用标卷内径(mm):
    Applicable standard volume inner diameter
    φ76mm
    贴标精度(mm):Label accuracy (mm) ±1mm
    出标速度Label out speed(m/min): 步进Step 5~25m/min
    伺服Servo: 5~40m/min
    贴标速度Labelling speed(pcs/min) 步进Step 40~150pcs/min
    伺服Servo: 50~200pcs/min
    输送速度Conveying speed(m/min) 5~16m/min
    重量Weight(kg): 约Around 180kg
    频率Frequency(HZ): 50HZ
    电压Voltage(V): 220V
    功率Power(W): 950W
    设备外形尺寸(mm)(长×宽×高)
    Euipment dimensions (mm)
    (length x width x height)
    2200mm×700mm×1400mm


    应用Application
    1.适用流体点胶,例如: UV胶、AB胶、EPOXY(黑胶)、白胶、EMI导电胶、SILICON、环氧树脂、瞬间胶、银胶、

    红胶、锡膏、散热膏、防焊膏、透明漆、螺丝固定剂等
    It is applied to fluid dispensing, such as, UV glue, AB glue,COB(black glue), white glue, EMI conductive glue, silicon,

    epoxy resin, instant glue, silver glue,red glue, paste, thermal grease, welding control paste, transparent paint, screw

    fixative and so on.
    2.应用于PCB电子配件固定及保护,手机、笔记本外壳粘接,LCD玻璃,LED点胶,双摄像头点胶与封装,指纹模组点胶,

    车配件涂覆,芯片绑定,电池封装,喇叭点胶,SMT底部填充、元件封装、点锡膏、点红胶、点黑胶、半导体封装、

    晶元固定等;
    Applied to PCB electronic accessories fixed and protection, and mobile phone, notebook shell adhesive,LCD glass,

    LED point glue, dual cameras dispensing with encapsulation, fingerprint module point glue, auto parts coated,

    chip binding, battery encapsulation, horn point glue, SMT at the bottom of the filling,packaging, dispensing,

    points the red plastic, vinyl,semiconductor packaging, wafer fixed and etc .


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